http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013115222-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
filingDate | 2011-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a297ec3440e5a0dcc8501441ed6e7e5c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc979d05605a4940b2436468ce3977a5 |
publicationDate | 2013-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2013115222-A |
titleOfInvention | Wiring board |
abstract | PROBLEM TO BE SOLVED: To provide a low thermal expansion wiring board with improved electrical reliability. A wiring board 3 of the present invention includes an insulating layer 8 and a conductive layer 13 formed on the insulating layer 8. The insulating layer 8 has a particle size smaller than the wavelength of visible light and has a neck. The plurality of first inorganic insulating particles 16 that are at least partially connected to each other through the structure, and the first inorganic insulating particles 16 are larger in particle diameter, and the first inorganic insulating particles 16 are interposed between each other. And a plurality of first inorganic insulating particles 16 and a resin material 15 filled around the plurality of colorant particles 17. As a result of being able to reduce the thermal expansion coefficient of the insulating layer 8, it is possible to reduce the application of thermal stress to the connection portion between the wiring board 3 and the electronic component, and to improve the electrical reliability of the wiring board 3. [Selection] Figure 2 |
priorityDate | 2011-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.