| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate |
2011-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b77694f71b2ab326ba5779779ce7c3c8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2371b964021754864e75169bd71130bf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62b7f0823e14d298246464a06931fe82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3099d4153d812bc314912c50c9a111d5 |
| publicationDate |
2013-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2013115170-A |
| titleOfInvention |
Printed wiring board, method for producing the same, and photosensitive resin composition |
| abstract |
A method for efficiently manufacturing a printed wiring board having a solder resist having a fine pattern and excellent reliability on a surface thereof is provided. A method of manufacturing a printed wiring board having a solder resist having an opening on a surface thereof, the step of forming a first layer comprising a first photosensitive resin composition that functions as a dry film resist, a solder Forming a second layer made of a second photosensitive resin composition that functions as a resist. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016038587-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022265030-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019095719-A |
| priorityDate |
2011-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |