| abstract |
Provided are a photosensitive resin composition capable of forming a resist pattern excellent in resolution, adhesion and flexibility, a photosensitive element using the same, a method for forming a resist pattern, and a method for producing a printed wiring board. . The photosensitive resin composition of the present invention contains a binder polymer having a dispersity of 1.6 or less, a photopolymerizable compound containing a (meth) acrylate compound having a urethane bond, and a photopolymerization initiator. To do. [Selection figure] None |