| abstract |
PROBLEM TO BE SOLVED: To provide a good adhesive sheet for a semiconductor capable of picking up a semiconductor element with an adhesive layer without making a mistake even when there is heat storage of a collet. A release film, an adhesive layer partially formed on the release film, and an adhesive formed so as to cover the adhesive layer and to contact the release film around the adhesive layer In accordance with JIS K 7127/2/300, a 25 mm wide strip-shaped sample of the adhesive film is subjected to a tensile strength test at a distance between the marked lines of 100 mm and a distance between the grips according to JIS K 7127/2/300. When carried out, the adhesive film has no yield point up to an elongation of 20%, and the adhesive film for semiconductor has a 5% modulus of 6.0 MPa or more. [Selection] Figure 1 |