| abstract |
Disclosed is a metal foil for heat dissipation that can be applied to electrical and electronic parts and has excellent heat dissipation and thermal conductivity and excellent flexibility. The base metal foil is copper, aluminum, nickel, iron or stainless steel, and adheres nickel or nickel alloy particles and aggregates on at least one surface thereof to roughen the surface, and nickel and A roughened metal foil coated with a layer made of sulfur or / and phosphorus, and a metal foil having an emissivity of 0.35 or more. [Selection] Figure 2 |