http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013093634-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_669c01133740c5233f2c8738904ea3af |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 |
| filingDate | 2013-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_90fb69bd5e59dabfc0b9bb41a82e62d5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a97e7a907b504e8cb09ae42691a3076 |
| publicationDate | 2013-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2013093634-A |
| titleOfInvention | Method for manufacturing printed wiring board |
| abstract | A metal fine particle sintered film such as copper wiring is formed on a substrate such as polyimide, the interface between the base material and the metal fine particle sintered film is smooth, and the adhesion between the substrate and the metal fine particle sintered film is high. To provide a printed wiring board. A step of printing a coating liquid containing metal or metal oxide fine particles on a substrate to form a printed layer, a step of firing the printed layer to form a metal fine particle sintered film, and a pattern shape A method for producing a printed wiring board having a step of obtaining a metal fine particle sintered film, wherein the firing treatment is performed by surface wave plasma generated by application of microwave energy which is an electromagnetic wave having a frequency of 300 MHz to 3000 GHz, An average roughness of an interface between a substrate and a metal fine particle sintered film is 30 nm or less. [Selection figure] None |
| priorityDate | 2013-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.