| abstract |
PROBLEM TO BE SOLVED: To provide a die bonding resin paste capable of forming a die bonding layer capable of satisfying all of low tack, low elastic modulus and adhesive strength at a high level by a printing method, and a semiconductor device using the same A manufacturing method and a semiconductor device are provided. A resin paste for die bonding includes a butadiene resin (A), a thermosetting component (B), a filler (C), a rubbery filler (D), and 1 in an atmosphere of 25 ° C. and 50% RH. Including the solvent (E) having a moisture absorption rate of less than 1% over time, the content of the rubber filler (D) is based on the total amount of the component (A), the component (B) and the component (D). It is 5-28 mass%. [Selection figure] None |