| abstract |
The present invention is suitable for forming an interlayer insulating film having high heat resistance, high solvent resistance, high transmittance, and low dielectric constant, and has a large development margin capable of forming a good pattern shape even if the optimum development time is exceeded. Providing a positive photosensitive resin composition. A positive photosensitive composition containing a polysiloxane compound obtained by subjecting the following compound (1) and compound (2) to a hydrolytic condensation reaction, a photoacid generator and an organic solvent. R 1 is a C 1-4 alkyl group or a C 6-10 aryl group, R 2 is a C 2-10 divalent hydrocarbon group, R 3 is a C 2-10 divalent saturated aliphatic hydrocarbon group, X 1 and X 2 are An acid dissociable, dissolution inhibiting group. [Selection figure] None |