| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_399d433982220f3203f7f18db8c9aa28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24aca9ded2638ea793d05360dde7a4a0 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-704
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0141
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2264-104
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2264-102 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D177-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| filingDate |
2011-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5a4a751c1a2c4834f9b53ced43e8f64
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ccb17943219ed8f7576da2bc5791eb16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e83f4377d128557a2961422d626fc66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72d5cebea83987f9ccdbabc7ecf0f549 |
| publicationDate |
2013-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2013091179-A |
| titleOfInvention |
Circuit board laminate and metal base circuit board |
| abstract |
The present invention provides a technique advantageous for realizing a metal base circuit board having excellent heat dissipation, voltage resistance, insulation and peel strength. SOLUTION: A metal substrate 2 and a liquid crystal polyester provided on the metal substrate 2 and containing 50% by volume or more and less than 65% by volume of an inorganic filler, the inorganic filler comprising aluminum oxide and boron nitride. And the ratio of the boron nitride in the inorganic filler is 10% by volume or more and less than 35% by volume, and the circuit comprising the metal foil 4 provided on the insulating layer 3 Laminate board 1 for substrates; a metal base circuit board obtained by patterning the metal foil 4 of the laminate 1 for circuit boards. [Selection] Figure 2 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015166609-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10544341-B2 |
| priorityDate |
2011-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |