http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013084847-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24aca9ded2638ea793d05360dde7a4a0 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G63-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate | 2011-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8427d4f637995019f9f9bfb10e5f6b8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f8ffadab98f64742089efbb2a980fcc9 |
| publicationDate | 2013-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2013084847-A |
| titleOfInvention | Method for manufacturing metal-based circuit board |
| abstract | A metal base circuit board having an insulating layer formed of liquid crystal polyester and having excellent heat resistance, adhesion strength between a conductor circuit and an insulating layer, and heat dissipation is provided in an inert gas atmosphere when the insulating layer is formed. Of a method for producing a metal-based circuit board, which can be produced without increasing the molecular weight of liquid crystal polyester in A method of manufacturing a metal base circuit board 1 in which a conductor circuit 4 is provided on a metal base 2 with an insulating layer 3 interposed therebetween, wherein a liquid crystal polyester liquid composition containing a solvent and a liquid crystal polyester is used as a conductor. Coating on a conductive foil for forming a circuit 4, removing the solvent to form the insulating layer 3, laminating the metal base 2 on the insulating layer 3, and subjecting the resulting laminate to a vacuum or A step of thermocompression bonding the insulating layer and the metal base by hot pressing in an inert gas atmosphere, wherein the liquid polyester has a flow start temperature of 300 to 340 ° C. A method of manufacturing a circuit board. [Selection] Figure 2 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2015050080-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10765001-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015050080-A1 |
| priorityDate | 2011-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 96.