| abstract |
Printed wiring capable of forming via holes that reach the substrate in a resin insulating layer on the substrate by ultraviolet laser irradiation without forming a surface layer portion around the via hole and making fine and rapid via holes. Provided are a laminated structure for a board and a method for producing a printed wiring board using the same. [Solution] A substrate, a second cured coating layer formed on the substrate, and a first cured coating layer formed between the second cured coating layer and the substrate, The second cured coating film is formed from a thermosetting resin composition containing (C) a polyimide resin having a multi-branched structure and (D) a polyfunctional alicyclic epoxy resin, and the first cured coating film is A laminated structure for a printed wiring board, which is formed of a thermosetting resin composition containing at least one component having ultraviolet absorptivity. [Selection] Figure 1 |