| abstract |
An object of the present invention is to form a copper pattern film composed of a copper fine particle sintered film having a low surface resistance value with suppressed film cracking even on a thick film, having high dispersibility, and suitable for inkjet printing. And a copper fine particle dispersion capable of reducing the firing temperature and / or firing time. A copper fine particle having an average primary particle size of 1 to 200 nm, a dispersant having a polyether structure and a weight average molecular weight in the range of 500 to 50,000, and a dispersion medium, and a silicone system A copper fine particle dispersion containing 0.1 to 1.0% by mass of an additive and / or a fluorine-containing additive. [Selection figure] None |