http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013077619-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f56b5174f7d196258707ccf1d609796e |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate | 2011-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aef0e7f56efc9340ab6131a6a77258ca |
| publicationDate | 2013-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2013077619-A |
| titleOfInvention | Manufacturing method of semiconductor device |
| abstract | The uniformity of a copper plating film is maintained while reducing hardware troubles in an electroplating apparatus. An automatic analyzer detects a voltage applied between electrodes and determines whether the voltage value is within a set voltage range. When the detected voltage value is lower than the lower limit value of the set voltage range, the automatic analyzer 14 calculates an insufficient amount of the basic solution based on the detected voltage value, and controls the valve 11 to control the basic amount of the insufficient amount. After the solution is replenished, the operation of the valve 13 is controlled so that the plating solution in the plating solution tank 6 maintains a specified amount, and the plating solution is discarded. Further, when the detected voltage value is higher than the upper limit value of the set voltage range, the excess amount of the basic solution is calculated based on the detected voltage value, and the concentration of the basic solution is within the specified range by controlling the valve 12. After replenishing the plating solution tank 6 with pure water and diluting the plating solution, the plating solution is drained to control the valve 13 and maintain a specified amount. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2019175990-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015200029-A |
| priorityDate | 2011-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.