| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-96
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68336 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 |
| filingDate |
2011-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43865c420f84df6cbbea8f7b0d053979
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72f4912ccaae2639c99fcffa12800a6c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d558f51235128c0066525fc05b80de3d |
| publicationDate |
2013-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2013074182-A |
| titleOfInvention |
Manufacturing method of semiconductor device |
| abstract |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of improving production efficiency and flexibility of manufacturing design of the semiconductor device. The present invention relates to a method of manufacturing a semiconductor device including a semiconductor chip, the step of preparing a semiconductor chip in which a conducting member is formed on a first main surface, and a radiation on a support that transmits radiation. A step of preparing a support structure in which a curable pressure-sensitive adhesive layer and a first thermosetting resin layer are laminated in this order; and the first thermosetting resin layer and the first main surface of the semiconductor chip. A step of disposing a plurality of semiconductor chips on the first thermosetting resin layer so as to face each other, and a second thermosetting resin layer covering the plurality of semiconductor chips with the first thermosetting type The step of laminating on the resin layer, and the radiation curable pressure-sensitive adhesive layer are cured by irradiating radiation from the support side, whereby the radiation curable pressure-sensitive adhesive layer and the first thermosetting resin layer And a step of peeling between them. [Selection] Figure 2 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017078037-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109417058-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6206828-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017209178-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016058514-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017045867-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017045794-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016092106-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109417058-B |
| priorityDate |
2011-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |