| abstract |
Moisture resistance reliability can be improved when copper wire is used, and an epoxy resin composition for semiconductor encapsulation capable of suppressing deformation of a copper wire and warping of a package during molding, and the use thereof A semiconductor device is provided. An epoxy resin composition for encapsulating a semiconductor, which contains an epoxy resin, a curing agent, and an inorganic filler as essential components, and is used as a molding material for an area mounting package using a copper wire for electrical connection of a semiconductor element. In the epoxy resin, the following formula (I): [Chemical 1] And a biphenyl type epoxy resin having a hydrolyzable chlorine content of 10 to 20 ppm. [Selection figure] None |