| abstract |
A wiring board for a light-emitting device capable of suppressing oxidation of a wiring pattern is provided. A wiring substrate includes a substrate, a wiring pattern formed on a first main surface of the substrate, a plating layer formed so as to cover a surface of the wiring pattern, and a plating. And an insulating layer 40 formed on the first main surface R1 so as to cover the wiring pattern 20 on which the layer 30 is formed. The insulating layer 40 is formed with an opening 40X that exposes a part of the wiring pattern 20 on which the plating layer 30 is formed as a mounting area CA of the light emitting element. The plating layer 30 includes a first plating layer 31 made of Ni or Ni alloy formed on the surface 20A of the wiring pattern 20, a second plating layer 32 made of Pd or Pd alloy, and a third plating made of Au or Au alloy. It has a three-layer structure in which the layer 33 is laminated in order. [Selection] Figure 1 |