http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013058725-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-122 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0237 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4673 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2012-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_216800c13bf3ab41788375e6c897230c |
| publicationDate | 2013-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2013058725-A |
| titleOfInvention | Printed wiring board, manufacturing method thereof, and metal surface treatment liquid |
| abstract | An object of the present invention is to provide a printed wiring board excellent in adhesion of an insulating layer and a method for manufacturing the same. A printed wiring board comprising an insulating substrate, a metal wiring disposed on the insulating substrate, and an insulating layer disposed on the metal wiring, wherein an equation (1) is applied to an interface between the metal wiring and the insulating layer. The printed wiring board in which the layer of the thiol compound which has four or more functional groups represented by this is interposed. (In formula (1), * represents a bonding position.) [Selection figure] None |
| priorityDate | 2011-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 49.