http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013055299-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c5520dd38cc403678d9f91e0b0ee95fb |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 |
| filingDate | 2011-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74ae7a7ab2400490ba7efffed819242f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06f5013f0582fba2b42929521aeddb6f |
| publicationDate | 2013-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2013055299-A |
| titleOfInvention | Resist removal method, repair method, and element |
| abstract | The present invention provides a resist removal method that does not leave a resist residue and that can suppress damage to a lower layer (for example, a semiconductor layer) of the resist as compared with the related art. The present invention is an invention of a resist removal method for removing a part of a resist 3 attached to an element as an object to be removed. In the present invention, for example, a part of the removal target is subjected to removal processing and the remaining part 6 of the removal target is exposed to the laser light 4 having a wavelength that is absorbed by the resist toward the removal target. By removing the exposed portion 6 by development, a part of the resist 3 applied to the semiconductor element is removed. [Selection] Figure 1 |
| priorityDate | 2011-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.