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filingDate 2011-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_261cb31eab2c64ea5303853156232037
publicationDate 2013-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2013054851-A
titleOfInvention Conductive particle, method for producing conductive particle, anisotropic conductive material, and connection structure
abstract Provided are conductive particles that are less likely to crack in a solder layer that has been melted and solidified when used for electrical connection between electrodes, and an anisotropic conductive material using the conductive particles. The conductive particles according to the present invention include a base particle and a solder layer disposed on a surface of the base particle, or are solder particles. The solder layer 4 or the solder particles include a reinforcing material that suppresses solder cracking. The anisotropic conductive material according to the present invention includes conductive particles 1, 11, and 31 and a binder resin. [Selection] Figure 1
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