| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2dcebf5a7f7ddc3b081f70e8ce1c4097 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1305
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49826
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B21C23-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23P15-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B21C23-002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28F21-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B21C23-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3735
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3736
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-36 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36 |
| filingDate |
2012-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e13695c43b3a04d6b3dafac655b1704
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6e089b44d436729a45c25cb7b957914
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9089b399e3aa6692126657f08b3847e5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5464f5a0402453494936054b84aacce8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03ce33147489edb3688384757d2e5701 |
| publicationDate |
2013-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2013051386-A |
| titleOfInvention |
Heat sink and manufacturing method of heat sink |
| abstract |
An object of the present invention is to suppress mountain heat distortion, suppress peeling of a member to be joined, and suppress a decrease in thermal diffusivity. An insulating heat sink 13 (bonded member) or an electronic component 11 (bonded member) is bonded to one surface of a metal heat sink 1, and a heat sink 15 (cooling member) is contacted to the other surface. And a metal plate 20 having a larger coefficient of thermal expansion than the insulating heat sink 13 and an embedded metal 30 embedded in the metal plate 20. The metal plate 20 includes a central portion 21 to which the insulating heat radiating plate 13 or the electronic component 11 is joined, and a plurality of linear slits 26 formed in a swirling radial shape so as to surround the central portion 21. The embedded metal 30 is embedded in the slit 26 and is more easily plastically deformed than the metal plate 20 due to shear stress along the slit 26. [Selection] Figure 2 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102080664-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11510310-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150042586-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160075713-A |
| priorityDate |
2011-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |