http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013051353-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_34c067d1bbfe85ac23d961d454a35d0e
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-36
filingDate 2011-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f74de609fa36253ccf171c3640beb6a7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_805c8023faf5b99603fd48ddcdedeb4e
publicationDate 2013-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2013051353-A
titleOfInvention Wiring board connection method
abstract A wiring board connection method capable of reducing a dead space of a wiring board is provided. A wiring board connection method according to the present invention includes a first wiring board 1 and a second wiring board 2 on which a chip 24 or the like is mounted on a surface opposite to the surface to which the first wiring board 1 is connected. A method of connecting a wiring board to be connected using the anisotropic conductive paste 3, wherein a coating step of applying the anisotropic conductive paste 3 on the second wiring board 2, and the anisotropic conductive paste 3 A thermocompression bonding step in which the first wiring substrate 1 is disposed on the first wiring substrate 1 and the heater 4 is brought into contact with the first wiring substrate 1 to thermocompression-bond the first wiring substrate 1 to the second wiring substrate 2 at a pressure of 0.35 MPa or less. In the thermocompression bonding step, the plate-like elastic body 5 is placed on the opposite surface of the second wiring board 2 so that the portion where the heater 4 comes into contact with the elastic body 5 in plan view overlaps. Intervene. [Selection] Figure 4
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150139454-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014157878-A
priorityDate 2011-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23994
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359367
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID21226588
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID18674575
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID11586419
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419524915
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID421175740
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID413898522
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5352426
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419480933
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID412630162
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID94932
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419578761
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID10219741
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415795473
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID456367111
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8088
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359967
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426444792
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID420871390
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458437694
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426180740
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID4764
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5354495
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419577487
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419549163
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID12284

Total number of triples: 43.