http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013051353-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_34c067d1bbfe85ac23d961d454a35d0e |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-36 |
filingDate | 2011-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f74de609fa36253ccf171c3640beb6a7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_805c8023faf5b99603fd48ddcdedeb4e |
publicationDate | 2013-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2013051353-A |
titleOfInvention | Wiring board connection method |
abstract | A wiring board connection method capable of reducing a dead space of a wiring board is provided. A wiring board connection method according to the present invention includes a first wiring board 1 and a second wiring board 2 on which a chip 24 or the like is mounted on a surface opposite to the surface to which the first wiring board 1 is connected. A method of connecting a wiring board to be connected using the anisotropic conductive paste 3, wherein a coating step of applying the anisotropic conductive paste 3 on the second wiring board 2, and the anisotropic conductive paste 3 A thermocompression bonding step in which the first wiring substrate 1 is disposed on the first wiring substrate 1 and the heater 4 is brought into contact with the first wiring substrate 1 to thermocompression-bond the first wiring substrate 1 to the second wiring substrate 2 at a pressure of 0.35 MPa or less. In the thermocompression bonding step, the plate-like elastic body 5 is placed on the opposite surface of the second wiring board 2 so that the portion where the heater 4 comes into contact with the elastic body 5 in plan view overlaps. Intervene. [Selection] Figure 4 |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150139454-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014157878-A |
priorityDate | 2011-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 43.