http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013045900-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2011-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12947c44bbf5a3a86e5bc8f680620620 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_910ca8df1decb50d9133142d31f49ff1 |
| publicationDate | 2013-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2013045900-A |
| titleOfInvention | Wiring board |
| abstract | PROBLEM TO BE SOLVED: To provide a highly reliable wiring board by satisfactorily depositing a plating layer on a surface metal layer on the wiring board. A wiring board according to the present invention is provided in an insulating substrate, a heat-dissipating member containing CuW, and a heat-dissipating member. A first surface metal layer 3a which is provided on the surface of the insulating base 1 so as to be in contact with and covers the heat radiating member 2 and which contains Mo as a main component and has a surface portion containing Cu, and the insulating base 1 The second surface metal layer 3b, which contains Mo as a main component and has a surface containing Cu, is provided on the surface of or inside the insulating base 1, and the second surface. The metal member 3c which consists of CuW in contact with the metal layer 3b, and the plating layer each provided on the 1st surface metal layer 3a and the 2nd surface metal layer 3b are provided. A plating layer can be deposited on the surfaces of the first surface metal layer 3a and the second surface metal layer 3b starting from Cu. [Selection] Figure 2 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016017673-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3846202-A4 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020045480-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11582858-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2020045480-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7300454-B2 |
| priorityDate | 2011-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.