| abstract |
Disclosed is an epoxy resin composition for an optical semiconductor device, which is excellent in heat discoloration, can provide good light reflectivity, and can provide a reflector excellent in mechanical strength. An epoxy resin composition for forming a reflector of an optical semiconductor device, comprising an optical semiconductor element 2 mounting region, and a reflector 3 formed at least partially surrounding the periphery of the device mounting region. And while the said epoxy resin composition contains the following (A)-(D) component, it contains the following (E) component as a mold release agent. (A) an epoxy resin, (B) a curing agent, (C) a white pigment, (D) an inorganic filler, (E) a mold release agent represented by the following structural formula (1). [Selection] Figure 1 |