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http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_95136e4276343dbae035a63330dabfc7
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G63-195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G63-181
filingDate 2011-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ddcc4bbb72ebfecf2667f5d58851560d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe6700103bf273dbb50fb1c7445550d7
publicationDate 2013-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2013035987-A
titleOfInvention Copolyester resin
abstract [Problem] To provide a polyester resin having excellent flexibility at room temperature and improved brittleness, and having excellent wet heat durability and flame retardancy, and more specifically, for molding of electrical and electronic parts, etc. And a copolyester resin suitable for potting processing. A co-polymer comprising an acid component containing an aromatic dicarboxylic acid component and a dimer acid, and a glycol component containing 1,4-butanediol, polybutadiene glycols, and an ethylene oxide adduct of tetrabromobisphenol A. It is a polymerized polyester resin, the proportion of dimer acid in the acid component in the copolymerized polyester resin is 10 to 50 mol%, the proportion of 1,4-butanediol in the glycol component is 50 mol% or more, in the glycol component The ratio of the polybutadiene glycol is 0.5 to 20 mol%, and the ratio of the tetrabromobisphenol A ethylene oxide adduct in the glycol component is 5 to 15 mol%. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019108513-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7363016-B2
priorityDate 2011-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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