| abstract |
A resin having excellent dielectric properties possessed by a polyarylene ether copolymer, excellent heat resistance of a cured product, and capable of sufficiently suppressing appearance defects when used in producing a prepreg. An object is to provide a composition. A polyarylene ether having an intrinsic viscosity of 0.03 to 0.12 dl / g measured in methylene chloride at 25 ° C. and having an average of 1.5 to 3 phenolic hydroxyl groups per molecule at the molecular ends. Copolymer (A), epoxy resin (B) having at least one selected from the group consisting of biphenyl type epoxy resin and naphthalene type epoxy resin having two or more epoxy groups in one molecule, and curing acceleration It is a resin composition characterized by including the agent (C) and having a content of the polyarylene ether copolymer (A) of 60 to 85% by mass. [Selection figure] None |