http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013032022-A

Outgoing Links

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41F17-14
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filingDate 2012-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_adb1693685f4f4145a25916788d75b46
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publicationDate 2013-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2013032022-A
titleOfInvention Transfer device
abstract Provided is a method for forming a metal thin film capable of realizing miniaturization and higher yield than conventional methods without increasing the resistance value of the thin film more than necessary. An electroless plating process is performed on a substrate on which an ink containing a catalyst material is transferred. A metal thin film 42 is selectively formed on the transfer region of the ink 2 </ b> A on the substrate 40. In addition, the ink 2 is transferred using the flat blanket 1 and contact is made by pressure compression in the transfer process. Positioning becomes easy and the pressure at the time of contact is made uniform as a whole, and the yield when forming the metal thin film 42 is improved. In addition, the ink 2 contains not the material of the metal thin film 42 itself but a catalyst material for electroless plating. Compared with the prior art, the resistance value of the metal thin film 42 is reduced, and the pattern can be easily miniaturized. [Selection] Figure 3
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017004449-A
priorityDate 2012-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 22.