http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013030700-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2011-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc979d05605a4940b2436468ce3977a5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e3bd5e439d80ec2f9ff35959ebc0524a |
| publicationDate | 2013-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2013030700-A |
| titleOfInvention | Wiring board and mounting structure |
| abstract | Provided is a wiring board that meets the demand for improving electrical reliability. A wiring board includes a first insulating layer, a first conductive layer formed on one main surface of the first insulating layer, and a first insulating layer that penetrates the first insulating layer in the thickness direction. And a first through conductor 8a connected to one conductive layer 7a. A plurality of first insulating layers 6a and first conductive layers 7a are alternately stacked. The 1st insulating layer 6a has the 1st resin layer 10a containing the base material 15, and the 1st inorganic insulating layer 11a formed in one main surface of this 1st resin layer 10a. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017212337-A |
| priorityDate | 2011-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.