| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45124 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 |
| filingDate |
2011-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1589785b3fb3faac5995e646223c34f0 |
| publicationDate |
2013-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2013026566-A |
| titleOfInvention |
Adhesive sheet for manufacturing semiconductor device, semiconductor device having adhesive sheet for manufacturing semiconductor device, and method for manufacturing semiconductor device |
| abstract |
PROBLEM TO BE SOLVED: To provide an adhesive sheet for manufacturing a semiconductor device which suppresses cracking and chipping of a semiconductor wafer and has chemical stability and easy physical property control. A cation and a complex having a thermoplastic resin having an epoxy group and not having a carboxyl group, a thermosetting resin, and a heterocyclic compound containing a tertiary nitrogen atom as a ring atom. An adhesive sheet for manufacturing a semiconductor device, comprising an organic complex-forming compound that forms a compound. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210123319-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210065107-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210065122-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210114010-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210064221-A |
| priorityDate |
2011-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |