| abstract |
An adhesive sheet having both a wafer fixing function and a die bonding function at the same time is provided that can relieve thermal stress between a chip and a wiring connection substrate. The adhesive sheet of the present invention has an adhesive layer that can be used as a die bonding agent on a radioactive polymerizable substrate, and therefore provides an adhesive sheet that has both a wafer fixing function and a die bonding function. it can. In addition, the adhesive layer has two types of resins that are phase-separated in a B-stage state, and has a resin (A) that forms a dispersed phase in a B-stage state and a resin (B) that forms a continuous phase, The resin (A) has a weight average molecular weight of 10,000 or less in an uncured state, and the resin (B) has a weight average molecular weight of 100,000 or more in an uncured state. [Selection figure] None |