http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013016666-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f56b5174f7d196258707ccf1d609796e |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50 |
| filingDate | 2011-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3b2d6eb7fa8f0a394304bebfe063b1cc |
| publicationDate | 2013-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2013016666-A |
| titleOfInvention | Semiconductor device |
| abstract | In a semiconductor device, there is provided a configuration for reducing crosstalk noise in a signal bonding wire without increasing the total number of external terminals and without significantly deteriorating signal transmission characteristics. A ground lead connected to a mount island is provided. The wire profiles of the signal bonding wire and the ground bonding wire that run side by side are aligned. The height of the connecting portion of the signal bonding wire and the signal lead is made equal to the height of the connecting portion of the ground bonding wire and the ground lead. [Selection] Figure 5 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110034086-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017059613-A |
| priorityDate | 2011-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.