| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1d29f7ac2c7f9be9f7dae1a83bbb5c92 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0796
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1291 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23G1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1844
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1651
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-63
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23G1-103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1216
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-246 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate |
2011-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_003200cdf2e0062ac04c7af29d08ff5b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b00cb25161aba464de5682439c446b4c |
| publicationDate |
2013-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2013016558-A |
| titleOfInvention |
Wiring substrate plating method, plated wiring substrate manufacturing method, and silver etching solution |
| abstract |
In a method for plating a wiring board having a conductive pattern in which a metal layer containing at least silver and copper is exposed on the outer surface, plating deposition in a portion other than the conductive pattern can be suppressed and a good plated layer on the surface of the conductive pattern Provided is a method for plating a wiring board that can be formed. A wiring substrate is treated with a first treatment liquid containing an oxidant, and the wiring substrate that has undergone the step (A) is treated with a second treatment liquid that dissolves copper oxide. By removing the copper oxide from the surface of the conductive pattern (B), and the wiring board that has undergone the (B) process, the rate of dissolving silver oxide (I) at 25 ° C. is copper (0) at 25 ° C. (C) The step of removing silver oxide from the surface of the conductive pattern by treating with a third treatment solution that is 1000 times or more the rate of dissolution, and the conductive pattern of the wiring board that has undergone the (C) step is electroless And (D) a step of plating. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102568034-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102371134-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016025329-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I656811-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016013473-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170039102-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20230030685-A |
| priorityDate |
2011-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |