http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013008829-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e3b0a3dbf8d6c9712d86ea1383fd5327 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0347 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11462 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2011-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3084d7f6abcf4e67556a6dc0f179c54c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32de91a0ee05569aaec7485a35ce8a67 |
| publicationDate | 2013-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2013008829-A |
| titleOfInvention | Method for forming Sn-Ag alloy solder bump |
| abstract | Provided is a solder bump forming method capable of keeping the composition of a metal component constant when forming a solder bump having a high aspect ratio pattern from an Sn-Ag alloy. An opening 13 is formed by a resist layer 12 on an electrode 11 formed on the surface of a wafer 1, and an Sn—Ag alloy plating solution is supplied to the opening 13 by electrolytic plating to provide solder bumps 15. In this method, the Ag concentration is made higher than the initial concentration in accordance with the increase in the acid concentration in the plating solution. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10062657-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160145191-A |
| priorityDate | 2011-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID104727 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419583196 |
Total number of triples: 18.