| abstract |
There is provided a method for manufacturing a flexible wiring board that does not require a seed layer and can be manufactured by a simple method, and has high conductivity, mirror-surface conductor adhesion, and highly reliable conductor adhesion strength. A flexible wiring board according to the present invention is an adhesive-free double-layer flexible wiring board in which a copper conductor is formed on one or both sides of a single unmetalized polyimide film, and includes the following steps, that is, a polyimide film: Are produced by sequentially performing drilling, reforming of the polyimide film surface, formation of a metal catalyst, formation of a plating resist film, electrolytic copper plating, peeling of the plating resist film, and metal catalyst etching. [Selection] Figure 2 |