| abstract |
There is provided a patterning method capable of shortening the tact time of pattern formation, enabling simultaneous firing of a pattern layer and a dielectric layer, and reducing the total cost of pattern formation. The pattern forming method of the present invention includes a coating step of coating a paste containing a conductive powder mainly composed of Sn, an organic binder, and a solvent on a substrate, and drying the coated paste. A drying process for forming a coating film, a laser irradiation process for drawing a conductive pattern on the dry coating film by laser irradiation, and a portion of the dry coating film that has not been irradiated with the laser is removed using a developer. And a developing step. [Selection figure] None |