http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013003541-A

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filingDate 2011-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_70d7ca9ff136418fec81987bab9aa478
publicationDate 2013-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2013003541-A
titleOfInvention Compound lens manufacturing method
abstract To provide a method for manufacturing a compound lens capable of preventing dust and chips from adhering to the surface of a wafer lens. By performing a charge removal process (step S13) on the wafer lens 100, it is possible to suppress the adhesion of dust to the wafer lens due to static electricity. Further, by performing the hydrophilic treatment (step S16) before dicing (step S15), it becomes easy to wash away the chips generated during dicing, and it is possible to prevent the chips from adhering to the surface of the wafer lens 100. . As described above, it is possible to prevent the surface of the compound lens 200 obtained by dividing the wafer lens 100 from becoming dirty. Further, it is possible to prevent the surface of the compound lens 200 from being damaged. Further, the reliability of the individual compound lens 200 by the temperature cycle test can be improved. [Selection] Figure 5
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