http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012528904-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-34928 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3492 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-098 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5313 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-06 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5313 |
| filingDate | 2009-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2012528904-A |
| titleOfInvention | Flame retardant semi-aromatic polyamide molding composition |
| abstract | A flame retardant polyamide molding composition based on semicrystalline polymer polyamide is provided. The polyamide molding composition comprises (A) at least one aliphatic or semi-aromatic having a melting point (T m ) of 30 to 92% by weight in the range of 240 ° C to 340 ° C, preferably 270 ° C to 340 ° C. (B) 0-50% by weight of at least one filler and reinforcing agent; (C) 8-18% by weight of at least one halogen-free flame retardant; (D) 0-2.0% % By weight of at least one barium carboxylate; (E) consisting of 0 to 5% by weight of at least one additive; where the sum of the weight% of components (A) to (E) is 100% When the proportion of (D) is in the range of 0 to 0.1% by weight, the halogen-free flame retardant component (C) is based on barium phosphinate. The invention further relates to the use of barium carboxylates in polyamide molding compositions with halogen-free flame retardants to inhibit the corrosive action during processing. The molding composition corresponds to the fire protection class UL 94V-0, has little or no corrosive action on the mechanical parts used for thermoplastic processing and exhibits good mechanical properties. The molding composition is particularly suitable for producing thin-walled moldings in the electrical and electronics industry, examples being housings, housing parts, connectors. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018095852-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7129086-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019508553-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5686930-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014132883-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018143110-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014148519-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018143110-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7040975-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9879127-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019172843-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2014132883-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012051954-A |
| priorityDate | 2009-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 397.