http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012524828-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-1438 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-5033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-10 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 2010-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2012524828-A |
| titleOfInvention | New epoxy resin and epoxy resin composition containing the same |
| abstract | A novel epoxy resin and an epoxy resin composition containing the same are provided. The present invention relates to a new epoxy resin having improved heat resistance, thermal expansion characteristics, and processability, and a thermosetting resin composition including the same, and an epoxy resin of Formula 1 in the specification and an epoxy resin composition including the epoxy resin And a packaging, substrate, and transistor manufactured thereby. In the epoxy resin having a specific side chain group and / or the epoxy resin having a specific core structure according to the present invention, the filler is chemically bonded to the epoxy resin when the composition containing the epoxy resin is cured. In addition to maximizing the filling effect of the filler on the epoxy resin, the heat resistance and thermal expansion characteristics of the cured product are greatly improved (CTE is reduced) due to the characteristics of the specific core structure, and improved glass Shows transition behavior, strength, and processability. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015203086-A |
| priorityDate | 2009-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 127.