| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20454 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 |
| filingDate |
2009-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2012-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2012503890-A |
| titleOfInvention |
Thermally conductive gel pack |
| abstract |
A thermally conductive gel pack is provided comprising a thermal gel encapsulated by a compliant material formed by a dielectric polymer. This gel pack is arranged between the opposing heat conducting surfaces of the electronic component. One heat conducting surface is part of the heat generating element of the electronic component, while the other heat conducting surface is part of the heat sink or circuit board. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019012720-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020014003-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016219599-A |
| priorityDate |
2008-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |