| abstract |
An adhesive tape comprising a flux active compound having a carboxyl group and / or a phenolic hydroxyl group, a thermosetting resin, and a film-forming resin. The thermosetting resin can be an epoxy resin and the thermosetting resin can include a curing agent. The curing agent can be an imidazole compound and / or a phosphorus compound. [Effect] Used as an interlayer material for circuit boards and multilayer flexible printed wiring boards. [Selection figure] None |