http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012251144-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
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filingDate 2012-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dbcdab43c11f83c1fdabd8f4339c7d0d
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publicationDate 2012-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2012251144-A
titleOfInvention Composite resin composition and molded article excellent in heat dissipation
abstract Disclosed is a composite resin composition that is superior in molding processability, light weight, and heat radiation to a metal material, and that is superior in thermal conductivity and mechanical strength to a resin material. A composite resin composition comprising (A) a heat conductive fiber and (B) a resin as a constituent material, and measured by a laser flash method in a molded product obtained by molding the resin composition. The thermal conductivity in the plane direction is 5 W / mK or more, the thermal conductivity in the thickness direction is less than half of the thermal conductivity in the plane direction, and the bending strength measured in accordance with JIS K 6911 is 80 MPa or more, The flexural modulus is 8 GPa or more, the specific gravity measured in accordance with JIS K 6911 is 1 or more and 5 or less, and the linear expansion coefficient in the plane direction is 0.1 ppm / ° C. or more and 50 ppm / ° C. or less. And a molded article excellent in thermal conductivity, characterized by using the composite resin composition. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015030100-A
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