Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_46eaa3874edeb66179a4a6905567d7f2 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D5-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D1-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B05D7-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0793 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-182 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41M1-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1608 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41M1-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1651 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2086 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41M1-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41M1-10 |
filingDate |
2011-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be3ce798d99a402c82b819bfcfc2aaed http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_559b57f9a109cb0062ea61cb85f5be28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3759b596821f8ca4bb50966b8beb94e9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6d83d807fea3fb018d2c2aec9c731072 |
publicationDate |
2012-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2012248770-A |
titleOfInvention |
Resin base material with metal film pattern |
abstract |
Provided is a method capable of efficiently forming a metal film pattern excellent in adhesion reliability and precision on a resin substrate using a low-concentration metal ion solution. A resin substrate having a metal film pattern is manufactured by a method including the following steps (a) to (e). (A) A step of pattern-printing a latent image agent on the surface of a resin substrate (b) A step of bringing a metal ion-containing solution into contact with a portion where the latent image agent is printed to generate a metal salt (c) A step of bringing the metal salt into contact with an acidic treatment solution containing a reducing agent; (d) a step of forming an electroless nickel plating film on the portion where the latent image agent is printed; and (e) an electroless copper on the surface of the nickel plating film. Process of depositing plating [Selection] Figure 1 |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015115212-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10344385-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014177697-A |
priorityDate |
2011-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |