| abstract |
A curable resin composition having excellent adhesion to an inorganic substrate is provided. A polyfunctional thiol compound (A) having a molecular weight of 200 to 2000, a polyfunctional epoxy resin (B) having a molecular weight of 200 to 50000 and an epoxy equivalent of 80 to 6000 g / mol, and a thioether-containing alkoxy represented by the general formula (1) A silane derivative (C) and an amine compound (D) having a molecular weight of 90 to 700 are included. The weight ratio ((A) / (B)) is 0.05-30. (A + B) 0.5 to 50 parts by weight of (C) and 0.01 to 50 parts by weight of (D) with respect to 100 parts by weight. (M in the formula is 1 or 2, R 1 is -CH 2 -CH 2 -, - CH 2 -CH 2 -CH 2 -, - CH (CH 3) -, or, -CH (CH 3) A divalent group represented by any one of —CH 2 —, R 2 is a methyl group or an ethyl group, and R 3 is a hydrocarbon group having 1 to 18 carbon atoms or a group having 1 to 3 carbon atoms; (It is a hydrocarbon group having 2 to 5 carbon atoms substituted by an alkoxy group.) [Selection figure] None |