| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a2973a1bdaf87d5184fb1e81ebe5d061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4283a2f8ade5dc582d75300427a38e50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ecdfc9030125055f06a260938acdacab |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E60-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M2-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-14 |
| filingDate |
2011-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0228b378a63293c39073f0f8a6f6d14e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e600cefc0a3165473037ea4f355bb210
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_89ea495528ad8975be3751032e99d160
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d1640275c1d9f7e787c873ff751a373 |
| publicationDate |
2012-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2012245665-A |
| titleOfInvention |
Molding method |
| abstract |
An object of the present invention is to provide an integrated molding method of a composite molded body of a thermoplastic resin and a dissimilar material that has excellent adhesion between a thermoplastic resin and a member made of metal or ceramics and also has excellent stress relaxation at the resin-member interface. To do. [Solution] When the thermoplastic resin is integrally formed with a member made of metal or ceramic, an epoxy resin adhesive layer that is B-staged or pregelled using an amine-based curing agent is formed on the entire surface of the member in contact with the thermoplastic resin. After forming in advance with a thickness of 5 to 500 μm, the member and the thermoplastic resin are molded at a mold temperature of 60 to 180 ° C., a thermoplastic resin injection temperature of 250 to 400 ° C., and a molding cycle time of 1 second to 3 minutes. The adhesive is cured during the molding cycle time at the molding temperature while being integrally molded. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015066846-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014128975-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7074584-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10406797-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016193513-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014075276-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015223841-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020001260-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015125966-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014168940-A |
| priorityDate |
2011-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |