abstract |
Provided are a wire bonding structure and an electronic device that can secure bonding strength and bonding reliability of bonding, and can realize rationalization and cost reduction of a bonding process, and a manufacturing method thereof. A bonding base formed by ultrasonically bonding a first aluminum wire to a bonding region of at least one electrode of a first electrode and a second electrode, and a base 14 and a bonding portion 2b formed by ultrasonic bonding of the second aluminum wire 2 to each other. The second aluminum wire 2 is made of a thinner wire than the first aluminum wire 3. [Selection] Figure 1 |