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filingDate 2011-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2012-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2012243943-A
titleOfInvention Wire bonding structure, electronic device and manufacturing method thereof
abstract Provided are a wire bonding structure and an electronic device that can secure bonding strength and bonding reliability of bonding, and can realize rationalization and cost reduction of a bonding process, and a manufacturing method thereof. A bonding base formed by ultrasonically bonding a first aluminum wire to a bonding region of at least one electrode of a first electrode and a second electrode, and a base 14 and a bonding portion 2b formed by ultrasonic bonding of the second aluminum wire 2 to each other. The second aluminum wire 2 is made of a thinner wire than the first aluminum wire 3. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015023212-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9673128-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016189420-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019004137-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018511175-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015012181-A1
priorityDate 2011-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 45.