http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012241178-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_063a1b324005ddc15e16e7529c6258c4 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2011-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad920a0e3f766a86f147538baf1449f4 |
| publicationDate | 2012-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2012241178-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| abstract | The present invention provides an epoxy resin composition for semiconductor encapsulation, which has excellent adhesion between a sealing resin and a nickel-plated lead frame, and can improve moisture absorption solder characteristics, and a semiconductor device using the same. An epoxy resin composition for encapsulating a semiconductor used as a molding material for encapsulating a semiconductor mounted on a nickel-plated lead frame containing an epoxy resin, a curing agent, an inorganic filler, and the following formula (I): . (In the formula, at least one of R 1 , R 2 and R 3 represents —CH 2 CH 2 COOH.) [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020017159-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3964594-A4 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015127397-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109429491-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019009097-A1 |
| priorityDate | 2011-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 86.