| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2919
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-351
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01012 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-08 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate |
2011-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b957f074d56e5f1bfb1bdbb58575ef42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_48b03303a847852712431db578a948b1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1589785b3fb3faac5995e646223c34f0 |
| publicationDate |
2012-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2012241157-A |
| titleOfInvention |
Adhesive composition for manufacturing semiconductor device and adhesive sheet for manufacturing semiconductor device |
| abstract |
PROBLEM TO BE SOLVED: To provide an adhesive composition capable of forming an adhesive sheet for manufacturing a semiconductor device capable of suppressing a decrease in ion trapping property after passing through a thermal history. An adhesive for manufacturing a semiconductor device comprising at least an organic complex-forming compound that forms a complex with a cation, wherein the organic complex-forming compound has a 5% weight reduction temperature of 180 ° C. or higher by thermogravimetry. Composition. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015126018-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160145010-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10598622-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2014112501-A1 |
| priorityDate |
2011-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |