http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012224679-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-17 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00 |
| filingDate | 2011-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a558e68c5ad5b4972f420d66b5bfba79 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd1011a500dbb41e83d3d2abce4b4de2 |
| publicationDate | 2012-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2012224679-A |
| titleOfInvention | Sealing material for secondary mounting underfill and semiconductor device |
| abstract | 【Task】 The present invention relates to a sealing material for secondary mounting underfill, and an object thereof is to provide a sealing material for secondary mounting underfill that provides a semiconductor device having excellent repair and reworkability and excellent thermal shock reliability. . [Solution] (A) Liquid epoxy resin (B) Amine-based curing agent (C) Inorganic filler 30-500 parts by mass with respect to a total of 100 parts by mass of the component (A) and the component (B), 25 in the inorganic filler component A semiconductor device comprising: a sealing material for secondary mounting underfill, wherein the mass% to 100% by mass is cristobalite, and a cured product of the sealing material. [Selection figure] None |
| priorityDate | 2011-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 63.