| abstract |
Provided is a sensor module that can be thinned while suppressing deterioration of detection characteristics. A sensor module includes a first plane, a second plane connected to the first plane at a right angle, and a third plane connected to the first plane and the second plane at a right angle. And a fourth plane 14 as an attachment surface to the external member that faces the first plane 11, and the first plane 11 has a support surface 11 a that is recessed from the first plane 11, The active surface 21 side has a connection terminal 22, and the inactive surface 29 side along the active surface 21 has an IC chip 20 attached to each surface 11 a, 12, 13 of the support member 10 and a connection electrode 39. The vibration gyro element 30 is disposed on the active surface 21 side of the IC chip 20 and is connected so that the main surface 30a is along each of the surfaces 11a, 12, and 13 of the support member 10, respectively. Electrode 39 is IC chip It is attached to the connection terminals 22 of 20. [Selection] Figure 1 |