| abstract |
An object of the present invention is to provide a solder paste, an electronic component, and an electronic device using the electronic component that can prevent a short circuit between electrodes due to molten solder when the electronic component is solder-connected to a printed wiring board or the like. A wiring board having electrode pads, a component mounted on the wiring board and having a plurality of electrodes, a sealing resin covering the component, and wiring in the wiring board are connected to an external board. A plurality of terminals, the plurality of electrodes are connected to the electrode pads by solder, and a first Young's modulus is provided between the solder and the sealing resin from the solder side. 1 is an electronic component in which a first resin layer and a second resin layer having a second Young's modulus larger than the first Young's modulus are sequentially formed. [Selection] Figure 1 |