http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012212922-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2012-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9fa541bbfa6bd95322db27c4a41f99c7 |
| publicationDate | 2012-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2012212922-A |
| titleOfInvention | Method for forming solder bump, solder bump, semiconductor device, and method for manufacturing semiconductor device |
| abstract | Provided is a solder bump forming method that does not require cleaning of flux and can form solder bumps at a narrow pitch. Moreover, the semiconductor device electrically connected by the solder bump obtained above is provided. A solder bump forming method supplies a resin composition containing a resin, a flux activator, and solder powder to one side of a substrate having electrode pads or a semiconductor element having electrode pads. And a forming step of heating the resin composition to agglomerate the solder powder around the electrode pads to form solder bumps. The solder bump is obtained by the solder bump forming method described above. The semiconductor device is electrically connected by the solder bump described above. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014152302-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10242961-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140115111-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016092233-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10433167-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102006637-B1 |
| priorityDate | 2012-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 62.